Integrated strobe module

ABSTRACT

A strobe module can include a Fresnel lens that defines an external surface of the strobe module and a sidewall at least partially defining an internal volume and defining an external channel. A gasket can be disposed in the external channel. A substrate can be coupled to the sidewall to further define the internal volume and a light source can be disposed on the substrate in the internal volume.

FIELD

The present disclosure relates generally to electronic devices. Moreparticularly, the present disclosure relates to output components andelectronic devices including the same.

BACKGROUND

As portable electronic devices continue to include an increasinglygreater number of features, integration of those features into a singledevice becomes increasingly complex. For example, certain features canrequire the emission of light from the electronic device, such as toimprove the lighting of a scene imaged by the device's camera, or toproject light that can interact with the ambient environment and displaycontent to a user or to be received by the device to determineinformation about the environment. Further, it can be desirable forcomponents and modules that emit light from a device to emit light witha high level of brightness, in order to improve performance or to enablevarious functions. Components and modules designed to emit light at sucha brightness level, however, can be undesirably large and can occupy anundesirably large fraction of a device's internal volume in order to behoused therein. Accordingly, it can be desirable to provide components,modules, and device configurations, such as light emitting modules thatcan emit light having a high brightness level while minimizing theinternal volume occupied by the light emitting module.

SUMMARY

According to some aspects of the present disclosure, a strobe module caninclude a Fresnel lens defining an external surface of the strobemodule, a sidewall at least partially defining an internal volume anddefining an external channel, a gasket disposed in the external channel,a substrate coupled to the sidewall and further defining the internalvolume, and a light source disposed on the substrate in the internalvolume.

In some examples, the Fresnel lens and the sidewall can include aunitary component. The Fresnel lens can be a separate component from thesidewall and can be joined thereto. The light source can include a lightemitting diode (LED). The light source can include two LEDs, and thestrobe module can further include an ambient light frequency sensor anda thermal sensor disposed on the substrate in the internal volume. TheFresnel lens can include polycarbonate. A portion of the Fresnel lensdefining the external surface can include an acrylic hard coat.

According to some aspects, an electronic device can include a cover atleast partially defining an external surface of the electronic deviceand defining an aperture, and a strobe module at least partiallydisposed in the aperture. The strobe module can include a Fresnel lensfurther defining the external surface of the electronic device, asidewall at least partially defining an internal volume of the strobemodule and defining a channel, a substrate coupled to the sidewall andfurther defining the internal volume, a light source disposed on thesubstrate in the internal volume, and a gasket disposed in the channelbetween the sidewall and the cover. The sidewall can be connected to thecover and the gasket can seal the sidewall and a surface of the coverdefining the aperture.

In some examples, the electronic device can further include a flexibleconnector joined to the substrate and in electrical communication withthe light source. The flexible connector can be joined to the substratewith solder. A distance from an internal surface of the cover to asurface of the solder protruding from the flexible connector can be lessthan 1 millimeter. The gasket can include an o-ring. The o-ring caninclude a same color as a portion of the cover defining the externalsurface. The light source can include an LED.

According to some aspects, a method of joining a module including apolymer to an electrical connector can include aligning an aperturedefined by the electrical connector with a pad of the module, placing aportion of solder over the aperture and the pad, selectively heating andmelting the portion of solder, and forming an electrical connectionbetween the electrical connector and the pad through the solder.

In some examples, selectively heating and melting the portion of soldercan include selectively exposing the portion of solder to laser light.The module can include a strobe module. The polymer can have a glasstransition temperature of less than 150° C. and the polymer can remainbelow the glass transition temperature during the selectively heatingand melting of the portion of solder. Forming the electrical connectioncan include solidifying the portion of solder. The solder can have aheight of less than 160 microns.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 shows a front perspective view of an electronic device.

FIG. 2 shows a rear perspective view of the electronic device of FIG. 1.

FIG. 3 shows an exploded view of the electronic device of FIG. 1.

FIG. 4 shows a cross-sectional view of an embodiment of a module of anelectronic device.

FIG. 5 shows a perspective view of a module of an electronic device.

FIG. 6 shows a cross-sectional view of an electronic device including amodule.

FIG. 7 shows a cross-sectional view of a module of an electronic device.

FIG. 8 shows an exploded cross-sectional view of a module of anelectronic device.

FIG. 9 shows a cross-sectional view of a module of an electronic device.

FIG. 10 shows a cross-sectional view of a module of an electronicdevice.

FIG. 11 shows a top view of a module of an electronic device.

FIG. 12 shows a process flow diagram for a process of joining a moduleand a connector.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents, as can be included withinthe spirit and scope of the described embodiments, as defined by theappended claims.

According to some examples, an electronic device can include a backcover that at least partially defines an external surface of the device,and that defines an aperture. A light emitting module or a strobe modulecan be disposed in the aperture and can include a transparent Fresnellens that further defines the external surface of the device. The strobemodule can include a sidewall at least partially defining an internalvolume of the module, and defining an exterior channel, and a substratecoupled to the sidewall that further defines the internal volume. Alight source can be disposed on the substrate in the internal volume ofthe module, and a gasket, such as an o-ring, can be disposed in thechannel. The sidewall can be coupled to the back cover, and the o-ringcan provide a substantially watertight seal between the sidewall and theback cover.

Electronic devices increasingly include components that can provide arange of functionalities for the device. For example, a device such as asmart phone can include, in addition to a camera for capturing images, alight emitting component, otherwise referred to as a strobe module orflash module, that can provide a desired amount of lighting to theambient environment, for example, to allow the camera to capture imageswhen there is a limited amount of environmental lighting. The strobemodule can perform other functions as well, such as acting as aflashlight, illuminating the ambient environment to facilitate othersensors or components of the device, serving as a signal or warning, orto display content to a user. Accordingly, it can be desirable toprovide components of an electronic device, such as a strobe module,that achieve high levels of desired performance, for example, levels ofperformance similar to standalone strobe modules or strobe modules ofdedicated camera devices, while minimizing the size or volume of suchcomponents in order to provide an electronic device that is as small asdesired and that includes as many components and functions as desired.

One way to provide a component, such as a strobe module, that has a highlevel of performance while minimizing the space of the device's internalvolume that the module occupies, is to position the module such thatsome or all of its dimensions occupy space that does not includecomponents in a traditional electronic device configuration. Forexample, an electronic device can include a housing that includes a wallor cover having a certain thickness. In some examples, especially wherea module requires access or communication with the ambient environment,the cover can include an aperture or recessed portion at the location ofthe module, and some or all of the module can be disposed in theaperture. As a result, some or all of the height of the module can bedisposed within the thickness of the cover, above the interior surfaceof the cover that at least partially defines the internal volume of thedevice. This configuration can allow for additional components to thenbe positioned below the module, for example, in space that the modulemight otherwise occupy in a traditional device configuration.

Such a configuration can impose additional requirements on the module inorder to maintain desired levels of module and device performance, aswell as a desired cosmetic appearance. For example, as described herein,when a module is disposed in an aperture defined by a cover of thedevice, a portion of the module can define a portion of the exteriorsurface of the device. Consequently, it can be desirable for theexterior portion of the module to be able to withstand the rigors ofdevice use and environmental exposure. As such, a portion of a moduledescribed herein, such as a lens, can have an exterior surface havinghigh levels of hardness, durability, and corrosion resistance.Traditional lens materials for strobe modules cannot satisfy theseperformance requirements while also satisfying the optical requirementsof the lens component. Accordingly, in some examples, a lens of a modulecan include a hard coating of a hard, durable, and/or corrosionresistant material overlying a bulk material that can be relativelyeasily formed into the desired lens structure, and that has the desiredoptical properties.

Further, as the strobe module of the device defines part of the exteriorsurface of the device adjacent to the cover, there can be a potentialpoint for the undesired ingress of water or other liquids orcontaminants into the device at the interface between the module and thecover. Accordingly, it can be desirable to provide a watertight seal atthis location. Traditional methods of sealing electronic devices includeproviding glue or an adhesive at the location desired to be sealed.These traditional techniques, however, can be subject to cracking orbrittle failure when under high levels of stress, for example, during adrop event or when exposed to a corrosive environment. Once thiscracking has occurred, for example, due to the relative movement ofcomponents with respect to one another, the seal can no longer functionas desired and the device will no longer be as waterproof as desired. Incontrast, a seal formed by a gasket, such as an o-ring, can maintain adesired seal, even under high loads because it is free to deform andmove in response to the loads without compromising the seal.Accordingly, it can be desirable to provide a module design thatincludes a gasket able to maintain a seal under a wide range of desiredconditions. Since this seal can be adjacent to or near the transparentlens of the module, in some examples, it can be visible to a user.Accordingly, the gasket or o-ring, as well as any other potentialvisible portions of the module, can be color matched to the exteriorcover of the device.

While the modules and electronic devices described herein can bedesigned and configured to maximize the available internal volume of thedevice for other components, it can be desirable to connect the moduleto an electrical connector in such a way that any solder or conductivematerial used to form the connection does not undesirably protrude fromthe module and occupy the space the module was designed to leaveunoccupied. Further challenges can arise because one or more materialsof the module, such as the polymeric material that can make up the lens,might not be able to withstand the temperatures generated by traditionalbonding or soldering techniques. Accordingly, it can be desirable toprovide processes for forming an electrical connection between themodule and a connector component that selectively heat and melt flowableconductive material to form a connection having a low or thin profile,and that do not heat these temperature sensitive portions of the moduleabove a desired threshold temperature.

These and other embodiments are discussed below with reference to FIGS.1-12. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 illustrates a perspective view of an example of an electronicdevice 100. The electronic device 100 shown in FIG. 1 is a mobilewireless communication device, such as a smartphone. The smartphone ofFIG. 1 is merely one representative example of a device that can be usedin conjunction with the systems and methods disclosed herein. Electronicdevice 100 can correspond to any form of a wearable electronic device, aportable media player, a media storage device, a portable digitalassistant (“PDA”), a tablet computer, a computer, a mobile communicationdevice, a GPS unit, a remote-control device, or any other electronicdevice. The electronic device 100 can be referred to as an electronicdevice, or a consumer device.

The electronic device 100 can have a housing that includes a frame or aband 102 that defines an outer perimeter and a portion of the exteriorsurface of the electronic device 100. The band 102, or portions thereof,can be joined to one or more other components of the device as describedherein. In some examples, the band 102 can include several sidewallcomponents, such as a first sidewall component 104, a second sidewallcomponent 106, a third sidewall component 108 (opposite the firstsidewall component 104), and a fourth sidewall component 110. Thesidewall components can be joined, for example, at multiple locations,to one or more other components of the device, as described herein.

In some instances, some of the sidewall components form part of anantenna assembly (not shown in FIG. 1). As a result, a non-metalmaterial or materials can separate the sidewall components of the band102 from each other, in order to electrically isolate the sidewallcomponents. For example, a first separating material 112 separates thefirst sidewall component 104 from the second sidewall component 106, anda second separating material 114 separates the second sidewall component106 from the third sidewall component 108. The aforementioned materialscan include an electrically inert or insulating material(s), such asplastics and/or resin, as non-limiting examples. Further, as describedherein, one or more of the sidewall components can be electricallyconnected to internal components of the electronic device, such as asupport plate, as described herein. In some examples, these electricalconnections can be achieved by joining a sidewall component to aninternal component, for example, as part of the antenna assembly.

The electronic device 100 can further include a display assembly 116(shown as a dotted line) that is covered by a protective cover 118. Thedisplay assembly 116 can include multiple layers (discussed below), witheach layer providing a unique function. The display assembly 116 can bepartially covered by a border 120 or a frame that extends along an outeredge of the protective cover 118 and partially covers an outer edge ofthe display assembly 116.

The border 120 can be positioned to hide or obscure any electricaland/or mechanical connections between the layers of the display assembly116 and flexible circuit connectors. Also, the border 120 can include auniform thickness. For example, the border 120 can include a thicknessthat generally does not change in the X- and Y-dimensions.

Also, as shown in FIG. 1, the display assembly 116 can include a notch122, representing an absence of the display assembly 116. The notch 122can allow for a vision system that provides the electronic device 100with information for object recognition, such as facial recognition. Inthis regard, the electronic device 100 can include a masking layer withopenings (shown as dotted lines) designed to hide or obscure the visionsystem, while the openings allow the vision system to provide objectrecognition information. The protective cover 118 can be formed from atransparent material, such as glass, plastic, sapphire, or other durabletransparent materials. In this regard, the protective cover 118 can bereferred to as a transparent cover, a transparent protective cover, or acover glass (even though the protective cover 118 sometimes does notinclude glass material). Further, in some examples, the vision systemcan include one or more modules as described herein, such as lightemitting modules and/or strobe modules.

As shown in FIG. 1, the protective cover 118 includes an opening 124,which can represent a single opening of the protective cover 118. Theopening 124 can allow for transmission of acoustical energy (in the formof audible sound) into the electronic device 100, which can be receivedby a microphone (not shown in FIG. 1) of the electronic device 100. Theopening 124 can also, or alternatively, allow for transmission ofacoustical energy (in the form of audible sound) out of the electronicdevice 100, which can be generated by an audio module (not shown inFIG. 1) of the electronic device 100.

The electronic device 100 can further include a port 126 designed toreceive a connector of a cable assembly. The port 126 allows theelectronic device 100 to communicate data (send and receive), and alsoallows the electronic device 100 to receive electrical energy to chargea battery assembly. Accordingly, the port 126 can include terminals thatelectrically couple to the connector.

Also, the electronic device 100 can include several additional openings.For example, the electronic device 100 can include openings 128 thatallow an additional audio module (not shown in FIG. 1) of the electronicdevice to emit acoustical energy out of the electronic device 100. Theelectronic device 100 can further include openings 132 that allow anadditional microphone of the electronic device to receive acousticalenergy. Furthermore, the electronic device 100 can include a firstfastener 134 and a second fastener 136 designed to securely engage witha rail that is coupled to the protective cover 118. In this regard, thefirst fastener 134 and the second fastener 136 are designed to couplethe protective cover 118 with the band 102.

The electronic device 100 can include several control inputs designed tofacilitate transmission of a command to the electronic device 100. Forexample, the electronic device 100 can include a first control input 142and a second control input 144. The aforementioned control inputs can beused to adjust the visual information presented on the display assembly116 or the volume of acoustical energy output by an audio module, asnon-limiting examples. The controls can include one of a switch or abutton designed to generate a command or a signal that is received by aprocessor. The control inputs can at least partially extend throughopenings in the sidewall components. For example, the second sidewallcomponent 106 can include an opening 146 that receives the first controlinput 142. Further details regarding the features and structure of anelectronic device are provided below, with reference to FIG. 2.

FIG. 2 shows a rear perspective view of the electronic device of FIG. 1.As can be seen, the device 100 can further include a back cover or backprotective layer 140 that can cooperate with the band 102 and protectivecover 118 to further define the internal volume and exterior surface ofthe device 100. The back cover 140 can be formed from any desiredmaterial, such as, metals, plastics, ceramics, composites, orcombinations thereof. In some examples, the back cover 140 can be formedfrom the same or a similar material to the protective cover 118. In someexamples, the back cover 140 can be a conductive transparent material,such as indium titanium oxide or a conductive silica. In some examples,the back cover 140 can define one or more apertures that can receive anyvariety of desired components, such as a camera or imaging module 160and a light emitting or strobe module 150. Further details regarding thefeatures and structure of an electronic device are provided below, withreference to FIG. 3.

FIG. 3 illustrates an exploded view of the electronic device 100. Thehousing of the device 100, including the band 102, can include one ormore features to receive or couple to other components of the device100. For example, the band 102 can include any number of features suchas apertures, cavities, indentations, and other mating features toreceive and/or attach to one or more components of the device 100.

The device 100 can include internal components, such as a system inpackage (SiP) 127, including one or more integrated circuits such as aprocessors, sensors, and memory. The device 100 can also include abattery 125 housed in the internal volume of the device 100. Additionalcomponents, such as a haptic engine, can also be included in the device100. The electronic device 100 can also include a display assembly 116,described herein. In some examples, the display assembly 116 can bereceived by and/or be attached to the band 102 by one or more attachmentfeatures. In some examples, one or more of these internal components canbe mounted to a circuit board 121. The electronic device 100 can furtherinclude a support plate 130, also referred to as a back plate orchassis, that can provide structural support for the electronic device100. The support plate 130 can include a rigid material, such as a metalor metals.

Such components can be disposed within an internal volume defined, atleast partially, by the band 102, and can be affixed to the band 102,via internal surfaces, attachment features, threaded connectors, studs,posts, and/or other fixing features, that are formed into, defined by,or otherwise part of the band 102. In some examples, an attachmentfeature can be formed by an additive process and/or a subtractiveprocess, such as machining.

The electronic device 100 can also include a light emitting or strobemodule, 150 as described herein. In some examples, the strobe module 150can be joined to, and can be in electrical communication with, anelectrical connector 152. In some examples, the electrical connector 152can be a flexible connector 152, and can further electrically connectthe strobe module 150 to one or more other components of the device 100,such as a controller and/or microprocessor. As can be seen, in someexamples, all or a portion of the strobe module 150 can be disposed inand/or received by the aperture 142 defined by the back cover 140. Thus,in some examples, a surface of the strobe module 150 can at leastpartially define an exterior surface of the device 100. In someexamples, the strobe module 150 can be coupled to, mounted on, orotherwise supported by the back cover 140, for example, by an adhesiveand/or by mounting hardware, as described herein. The back cover 140 canalso be attached to the band 102, for example, via the one or moreattachment features or by any other desired techniques, for example, byan adhesive.

Any number or variety of electronic device components can include one ormore modules, as described herein, such as a strobe module. The processfor joining such a module to an electrical connector can include anyform of localized heating and or cooling process that can melt, flow, orreflow conductive material to electrically connect the module to one ormore other components of an electronic device without undesirablyheating desired portions of the module. An electronic device includingthe module can include a cover defining an exterior surface of thedevice and an aperture. In some examples, the module can further definethe exterior surface, and can be disposed in the aperture such that oneor more desired components of the module can be positioned between theexterior surface and an interior surface of the cover. Various examplesof modules and electronic devices including the same, as well asprocesses for electrically connecting the same to other devicecomponents, are described below with reference to FIGS. 4-8.

FIG. 4 illustrates a perspective view of a module 250 that can be astrobe module 250 or light emitting module 250 and that can be includedin an electronic device as described herein. The strobe module 250 caninclude some or all of the features of the modules described herein,such as strobe module 150 described with respect to FIGS. 2-3. In thepresent example, the strobe module 250 can include a lens 255 that canbe formed from or comprise a transparent material, such as one or moretransparent polymeric materials.

In some examples, the lens 255 can be a compact lens, such as a Fresnellens as described herein, and can define an external surface 251 of thestrobe module 250. In some examples, this external surface 251 can atleast partially define the external surface of an electronic device, asdescribed herein. The lens 255 can comprise a transparent polymer, suchas polycarbonate. Further, the portion of the lens 255 defining theexternal surface 251 can comprise a second, different material that canbe harder than the material defining the bulk portion of the lens and/orthe optical features of the Fresnel lens 255. For example, the portionof the lens 255 defining the external surface 251 can comprise anacrylic hard coat material.

The strobe module 250 can further comprise a sidewall 253 that can atleast partially define an internal volume of the strobe module 250 andcan also define an external channel 254. In some examples, the sidewall253 and the lens 255 can be a unitary or singular component, for examplecomprising a continuous portion of a material, such as a transparentpolymer as described herein. A gasket 256 can be disposed in the channel254 defined by the sidewall 253. In some examples, the gasket 256 canserve to provide a seal between the sidewall 253 and a componentdisposed around the sidewall 253, for example a cover of an electronicdevice defining an aperture in which the strobe module 250 can bedisposed, as described herein. In some examples, the gasket 256 can bean o-ring.

In some examples, the sidewall 253 can be coupled to a substrate 252that can further define the internal volume of the strobe module 250.The sidewall 253 and substrate 252 can be coupled by any desired method,including by gluing or with an adhesive. Accordingly, in some examples,the sidewall 253, the lens 255, and the substrate 252 can cooperate todefine the internal volume of the strobe module 250. In some examples,the substrate can include a polymeric material, metallic material,ceramic material, or combinations thereof, and can be, for example, aprinted circuit board. A light source 258 can be disposed on thesubstrate 252 in the internal volume of the strobe module 250. The lightsource 258 can be an electrically powered light source 258, such as anLED light source 258. In some examples, the light source 258 can beelectrically connected to the substrate 252 and/or one or more othercomponents of an electronic device including the strobe module 250 asdescribed herein. Further details regarding the features and thestructure of various example of a light emitting module 350 are providedbelow, with reference to FIG. 5.

FIG. 5 illustrates a perspective view of a module 350 that can be astrobe module 350 or a light emitting module 350 that can be included inan electronic device, as described herein. The strobe module 350 caninclude some or all of the features of the modules described herein,such as strobe module 150 described with respect to FIGS. 2-3. In thepresent example, the strobe module 350 can include a lens 355 that canbe formed from, or can include, a transparent material.

The lens 355 can at least partially define an exterior surface of thestrobe module 350 as shown, and in some examples, where the strobemodule 350 can at least partially define an exterior surface of anelectronic device, the lens 355 can at least partially define theexterior surface of the electronic device. In some examples, the lens355 can include transparent polymeric materials, transparent ceramicmaterials, or combinations thereof. In some examples, the lens 355 caninclude polycarbonate material. In some examples, the portion of thelens 355 that at least partially defines the exterior surface of thestrobe module 350 can be treated or coated, such as to increasehardness, durability, chemical resistance, and/or corrosion resistance.Thus, in some examples, the lens 355 can further include a hard coatmaterial, such as a layer of an acrylic hard coat material, as describedherein.

In some examples, the lens 355 can be any desired form or design oflens. In some examples, the lens 355 can be a compact lens, such as aFresnel lens. In some examples, the lens 355 can be a multifocal lens.For example, the lens 355 can be a singular or unitary component, andcan include multiple regions that have separate or different focalpoints and/or focal lengths. In some examples, the lens 355 can have anydesired peripheral shape, although in certain examples, the lens 355 canhave a substantially circular or rounded peripheral shape. That is, insome examples, the lens 355 can be substantially cylindrical. In someexamples, the lens 355 can be formed by additive manufacturingprocesses, subtractive manufacturing processes, or combinations thereof.For example, the lens 355 can be formed by an injection molding and/ormachining process.

As used herein, the term ‘transparent’ can refer to a material orcomponent, such as the lens 355 that allows a desired wavelength orrange of wavelengths of light to pass therethrough. In some examples,the desired range of wavelengths of light can include visible light,ultraviolet light, infrared light, or combinations thereof. Although insome examples a transparent material or component can allowsubstantially all the incident light of a desired wavelength or range ofwavelengths to pass therethrough, in some examples, a transparentmaterial that allows about 90% of incident light, 80% of incident light,70% of incident light, 60% of incident light, or even 50% of incidentlight or less to pass therethrough can be useful in certainapplications.

The module 350 can further include a housing or sidewall 353 that can atleast partially surround and define an internal volume of the module350. The sidewall 353 can at least partially define an exterior surfaceof the module. In some examples, the sidewall 353 can assume any desiredshape, although in certain examples, the sidewall 353 can have aperimeter corresponding to or the same as a peripheral shape of the lens355. The sidewall 353 can also define an external channel 354. In someexamples, the channel can at least partially surround the internalvolume defined by the sidewall 353, and can have an overall shapecorresponding to, in line with, and/or similar to a peripheral shape ofthe lens 355. The channel 354 can have any desired cross-sectionalshape, although in some examples, the channel 354 can have asubstantially rectangular cross-sectional shape or profile.

In some examples, the sidewall 353 can further include a base portion orflange 351 that can extend from the portion of the sidewall 353 that atleast partially defines the internal volume. In some examples, the baseportion or flange can extend approximately perpendicularly therefrom andcan be coupled to and/or abut one or more other components, for example,to retain the sidewall 353, and thus module 350, in the device.

In some examples, the sidewall 353 can include the same material ormaterials as the lens 355. In some other examples, however, the sidewall353 can include any desired material or combination of materials, suchas polymeric materials, ceramic materials, metallic materials, orcombinations thereof. In some examples, the sidewall 353 can be aseparate component or portion from the lens 355, and can be joined orbonded thereto by any technique known in the art or developed in thefuture, such as with adhesive or glue. In some other examples, thesidewall 353 and the lens 355 can be a singular or unitary body orcomponent. That is, in some examples, the sidewall 353 and the lens 355can be portions of the same component and can be formed from, or caninclude, the same materials. In some examples, the sidewall 353 can bemanufactured by an additive manufacturing process, subtractivemanufacturing processes, or combinations thereof. For example, thesidewall 353 can be injection molded and the channel 354 can be formedin an exterior surface thereof by a machining process.

The module 350 can also include a substrate 352 that can further definethe internal volume of the module 350. The substrate 352 can include anydesired material or combination of materials, and in some examples, canbe a circuit board, such as a printed circuit board. Accordingly, thesubstrate can include one or more electrical components and/orelectrical contacts or connections. In some examples, and as describedfurther herein, one or more light sources (not shown) can be disposed onthe substrate 352 and disposed in the internal volume. For example, thelight sources can be disposed on the substrate 352 below the lens 355 sothat light emitted from the light sources can pass through the lens 355.The substrate 352 can be coupled to the sidewall 353, for example, atthe base or flange portion 351 of the sidewall 353. In some examples,the substrate can be coupled to the light emitting module 350 by anymethod known in the art or developed in the future, such as with anadhesive or a glue. Further details regarding the features and thestructure of various examples of a light emitting module 450 areprovided below, with reference to FIG. 6.

FIG. 6 shows a cross-sectional view of an electronic device 400including a module 450, such as a strobe module 450. The electronicdevice 400 can be substantially similar to, and can include some or allof the features of the electronic devices described herein, such aselectronic device 100 described with respect to FIGS. 1-3, while thestrobe module can be substantially similar to and can include some orall of the features of the modules described herein, such as module 250,350 described with respect to FIGS. 4-5.

The electronic device 400 can include a band 402 that can at leastpartially define an internal volume of the device 400. The electronicdevice 400 can also include a back cover 440 that can be attached orcoupled to the band 402 to further define the internal volume of thedevice 400. The back cover 440 can include an exterior surface 442 andan opposing interior surface 446. In some examples, the exterior surface442 can at least partially define an exterior surface of the device 400itself, while the interior surface 446 can partially define the internalvolume of the device 400. As described herein, the back cover 440 canalso define an aperture 444. In some examples, the back cover 440 caninclude any desired material, such as polymeric materials, ceramicmaterials, metallic materials, composite materials, or combinationsthereof. In some examples, the back cover 440 can include a ceramicmaterial such as glass or sapphire. Further, in some examples, the backcover 440 can have a thickness of about 2 millimeters, about 1.5millimeters, about 1 millimeter, about 0.9, 0.8, 0.7, or even 0.5millimeters or thinner at the location of the aperture 444.

As described with respect to module 350, the module 450 can include alens 455 including a transparent material or materials, such astransparent polymeric or ceramic materials. The lens 455 can includesome or all of the features of lens 355 and can be a Fresnel lens. Insome examples, the lens 455 can be disposed in the aperture 444. Thus,the exterior surface of the lens 455 can at least partially define anexterior surface of the device 400. In some examples, the lens 455 canhave a peripheral shape corresponding to the peripheral shape of theaperture 444. In some examples, the exterior surface of the lens 455 canbe substantially level or in line with the exterior surface 442,however, in some other examples, the exterior surface of the lens 455can be recessed from the exterior surface 442. The exterior surface 442can include one or more non-planar features at least partiallysurrounding the aperture 444 and the lens 455, such as the illustratedchamfer.

Similar to module 350, the module 450 can include a sidewall 453defining an internal volume of the module, and an external surface thatdefines a channel 454. In some examples, the sidewall 453 can be coupledto, abut, or be adjacent to the back cover. In some examples, at least aportion of the sidewall 453 can be disposed adjacent to or abutting thesurface 446 of the back cover and/or the surface of the back coverdefining the aperture 444. For example, the flange or base portion ofthe sidewall 453 can extend below or beneath the back cover 440 and canabut or be adjacent to the surface 446 at that location.

A gasket 456 can be disposed in the channel 454, and can abut or contactthe sidewall 453 and the back cover 440 to form or provide a sealtherebetween. In some examples, the gasket 456 can provide asubstantially watertight and/or airtight seal between the sidewall 453and the back cover 440. Further, the gasket 456 can be maintained in thechannel 454 by the portions of the back cover 440 abutting or disposedadjacent to the portions of the sidewall 453 above and below thechannel. In some examples, the gasket 456 can include a compliantmaterial, such as a polymeric material. In some examples, the gasket 456can include a rubber compound. The gasket 456 can substantially surroundthe internal volume of the module 450, and can have a peripheral shapeand size corresponding to the shape and size of the channel 454. In someexamples, the gasket 456 can have any one or a combination of a varietyof cross-sectional shapes or profiles, such as a rounded or circularcross-sectional shape. In some examples, the gasket 456 can be ano-ring. In some examples, the gasket 456 can be at least partiallyvisible to a user, for example, through the transparent material of thelens 455. Accordingly, in some examples, the gasket 456 can have a sameor similar color to the color of the surface 442 of the back cover 440.In some examples, the gasket 456 can include one or more dyes or colorparticles to achieve a desired color.

Further, in some examples, the channel 454 can have a largercross-sectional area than the o-ring 456, and can allow for the gasket456 to move within the channel 454 without breaking or interrupting theseal formed between the sidewall 453 and the back cover 440.Advantageously, the ability of the gasket 456 to move within the channel454, and with respect to both sidewall 453 and back cover 440, whilemaintaining contact with those components can allow for the maintenanceof the seal between the sidewall 453 and the back cover 440, even whenundesirable stresses are being exerted thereon. For example, atraditional seal formed between the sidewall 453 and the back cover 440that includes a rigid or non-moveable sealing component, often failsduring a high stress event, such as a drop event, thereby allowingpotential liquid ingress into the internal volume of the device at thatlocation. In contrast, the ability of the gasket 456 to move withrespect to the sidewall 453 and the back cover 440 allows the gasket todeform and even absorb stresses on these components, thereby maintainingthe seal during a high stress event, and advantageously continuing toprevent liquid ingress at the seal location.

While the example described with respect to FIG. 6 include a gasket 456to provide a seal between the back cover 440 and the module 450, in someexamples, substantially any method or sealing component can be used toprovide a seal between the back cover 440 and the module 450, such asadhesives, other forms or gaskets, or any other sealing method orcomponent.

The substrate 452, such as the printed circuit board described hereinwith respect to substrate 252, can be coupled to the sidewall 453, forexample, at the flange or base portion thereof. The substrate 452 canfurther define the internal volume of the module 450. One or more lightsources 458 can be disposed on the substrate 452 in the internal volumeof the module 450. The light sources 458 can include light emittingdiodes (LEDs), as described herein. In some examples, the light sources458 can be electrically connected to other components of the device 400,for example, through contacts or vias in the substrate 452. Thesubstrate 452 can include contacts on an exterior surface thereof thatcan be in electrical communication with a connector 459. The connector459 can be a flexible electrical connector 459 and can be electricallyconnected to the contact portions of the substrate 452 by a conductivematerial, such as portions of solder 457, conductive epoxy, or otherconductive materials, as described herein.

The module 450 can be retained in a desired position in the electronicdevice 400, for example, at least partially disposed in the aperture444, by any desired methods or components. In some examples, a brace 460can retain the module 450 in a desired position and location. The brace460 can be secured to other components of the device, such as the backcover 440 and/or the band 402, and can abut or be disposed adjacent toan exterior surface of the substrate 452 to retain the module 450. Insome examples, the brace 460 can exert a biasing force against themodule 450 to retain the module 450 in a desired position and location,and to maintain a positional relationship between portions of the module450, such as the sidewall 453 and the back cover 440. In some examples,a compliant material such as foam 461 can be disposed between the brace460 and portions of the module 450 such as the substrate 452. The foam461 can allow for the absorption or dissipation of forces exerted on themodule 450 or the device 400, while still maintaining the toleranceranges of the components therein.

As can be seen, the orientation and configuration of the module 450 andthe back cover 440 are such that many of the components of the module450 are disposed in the aperture 444 between the exterior surface 442and the interior surface 446 of the back cover 440. For example, thelens 455, portions of the sidewall 453, the gasket 456, and some or allof the light sources 458 can be disposed in the aperture between thesurfaces 442, 446 of the back cover 440.

Whereas some traditional strobe module and electronic device designs canhave the substantial entirety of the strobe module disposed within theinternal volume of the device below an interior surface 446 of a backcover 440, the present configuration allows for only a portion of themodule 450, such as the relatively thin substrate 452, to be disposed inthe internal volume of the device below surface 446. Accordingly, such adesign can maximize the space within the internal volume that is notoccupied by the strobe module 450. The exemplary configuration can allowfor increased utilization of the space below the strobe module 450. Insome examples, this design can allow for a thinner overall device 400compared to traditional device configurations. In some examples, thisdesign can allow for other components, such as component 470 to bedisposed directly below the module 450 that would not otherwise havebeen able to occupy this space without necessitating an increase indevice thickness. As a result, additional components and features can beincluded in an electronic device 400 without increasing the devicethickness or size because a large portion of the volume of the module450 is disposed above the surface 446 that partially defines theinternal volume. Further details regarding the features and structure ofexample of a module 550 are provided below, with reference to FIG. 7.

FIG. 7 shows a cross-sectional view of a module 550 of an electronicdevice, for example, a strobe module or light emitting module, asdescribed herein. The module 550 can be substantially similar to, andcan include some or all of the features of, any of the modules describedherein, such as module 150, 250, 350, 450 described herein with respectto FIGS. 3-6.

As can be seen, the module 550 can be disposed in an aperture defined bya cover 540 of an electronic device, and can abut or be disposedadjacent to the surface of the cover 540 defining the aperture. In someexamples, the module 550 can be at least partially retained in a desiredposition by a brace 560 that can be coupled to, or can exert a retainingforce on, the module 550, for example, through the substrate 552. Insome examples, a compliant component 561, such as a foam portion, can bedisposed between the substrate 552 and the brace 560. In some examples,the foam 561 can prevent direct contact between the brace 560 and themodule by absorbing or dissipating forces exerted on the module 550 bythe brace that might otherwise damage or exert undesirable loads on thesubstrate 552.

In the present example, the lens 555 includes the features of thesidewalls 253, 353, 453 described herein, and can be considered asingular or unitary component with the sidewall. That is, in someexamples, the lens 555 can include a surface that defines a groove orchannel 554, as well as a flange or base portion that can abut or bedisposed adjacent to an interior surface of the back cover 540. As withother modules described herein, a gasket, such as an o-ring 556, can bedisposed in the channel 554 and can seal the lens 555 and the back cover540, for example, to prevent the undesired ingress of liquids.

As the lens 555 can at least partially define an exterior surface ofboth the module 550 and the electronic device in which the module can beincluded, in some examples, it can be desirable for the exterior surfaceof the lens 555 to have high levels of hardness, durability, corrosionresistance, and/or chemical resistance. In some examples, the bulkmaterial of the lens 555, that is the material including the opticalfeatures of the Fresnel lens 555, can be selected based on propertiessuch as cost, ease of manufacturing, and/or optical properties, and willnot have the desired properties to function as an external surface of anelectronic device. In such instances, a material can be coated, formed,deposited, or otherwise integrated into or onto the surface of the lens555 that can be exposed to the ambient environment. In some examples,this coating material can be referred to as a hard coat or a hard coatmaterial. The hard coat material can include any desired material thatis transparent to the desired wavelengths or range of wavelengths oflight and that has a desired level of hardness, durability, corrosionresistance, chemical resistance, aesthetic appearance, and otherdesirable exterior characteristics.

In some examples, the hard coat can include a polymeric material, aceramic material, or combinations thereof. In some examples, the hardcoat can include a polymeric material such as acrylic. The hard coat canbe formed by any method or process known in the art or developed in thefuture. In some examples, the hard coat can cover or overliesubstantially the entire surface of the lens 555 that can be exposed tothe ambient environment. For example, the hard coat can be applied anyor all of the surface of the lens 555 disposed above the gasket 556. Insome examples, the entire exterior surface of the lens 555 can includethe hard coat material. In some examples, the hard coat can have athickness of less than about 100 microns, less than about 50 microns,less than about 25 microns, or less than about 15 microns or fewer. Insome examples, the hard coat can have a thickness between 1 microns and15 microns, between 5 microns and 15 microns, or between 8 microns and12 microns, for example, about 10 microns.

As with certain module examples described herein, the module 550 caninclude light sources 558 that are electrically connected to, anddisposed on, a substrate 552. In some examples, the light sources 558can include one or more LEDs. Accordingly, in this particular example,the module 550 can include two LEDs 558 disposed on the substrate 552 inthe internal volume defined by the lens 555 and the substrate. Thesubstrate 552 can further include one or more electrical contacts orpads disposed on a side that defines an exterior surface of the module550, for example, the side opposite the LEDs 558. The contact pads canelectrically connect components disposed on the substrate, for example,in the internal volume of the module 550, to one or more othercomponents of the device. The contact pads of the substrate can beelectrically connected to corresponding contacts of an electricalconnector, such as a flexible electrical connector 559. The electricalcontact between the substrate 552 and the connector 559 can be achievedor facilitated by a conductive bonding material, such as portions ofsolder 557. In some examples, each corresponding substrate 552 contactand flexible connector 559 contact can be electrically connected by aseparate portion of conductive material or solder 557. The substrate 552and the connector 559 can include any number of corresponding contacts,for example, between 1 and 20 contacts. In one example embodiment, thesubstrate 552 includes 8 contacts.

As described herein, it can be desirable for the module 550 to be asthin as possible in order to allow other components or features of thedevice to occupy the internal volume of the device that might haveotherwise been occupied by the module 550. Accordingly, it can bedesirable to minimize the distance that the portions of solder 557protrude from the flexible connector 559. In some examples, a solderportion 557 can protrude less than about 160 microns from the surface ofthe contact pad of the substrate 552. In some examples, the height fromthe interior surface of the cover 540 to the furthest surface of thesolder 557 can be less than 1000 microns, less than 900 microns, lessthan 850 microns, less than 800 microns, less than 750 microns, or lessthan 700 microns or smaller. In some examples, this height can be about835 microns.

Further, in order to prevent undesirable contact between the solder 557and other components of the device including the module 550, aprotective layer or component can be provided over the solder portions557. In some examples, this protective component can be a piece orpieces of tape or other relatively thin, non-conductive material thatcan serve to prevent or inhibit any inadvertent electrical contactbetween the solder 557 and other conductive portions of the device,including the module 550. This arrangement can allow for components tobe disposed below or adjacent to module 550 that would not otherwisefunction as desired if the solder 557 is not protected, as described.Additional structures and configurations of some examples of a module650 are described below, with reference to FIG. 8.

FIG. 8 shows an exploded cross-sectional view of a module 650 of anelectronic device, for example, a strobe module or light emittingmodule, as described herein. The module 650 can be substantially similarto, and can include some or all of the features of, any of the modulesdescribed herein, such as module 150, 250, 350, 450, and 550.

In some examples, the module 650 can include a unitary or singular lensand sidewall component 655 that can define a groove 654, as describedherein. A gasket 656, such as an o-ring, can be disposed in the groove654. The lens 655 can at least partially define an internal volume ofthe module 650, and a base or a flange portion thereof can be coupled toa substrate 652 that can further define the internal volume of themodule 650. In some examples, the substrate 652 can be coupled to thelens 655 by an adhesive or any other desired component or technique. Insome examples, light sources 658, such as LEDs 658 can be disposed onthe substrate 652 in the internal volume.

The substrate 652 can further include one or more electrical contacts orpads 691, 692, 693 disposed on a side of the substrate that defines anexterior surface of the module 650, for example, the side opposite theLEDs 658, as described herein. The pads 691, 692, 693 can be inelectrical communication with the LEDs 658 or other components disposedon the substrate 652. In order to electrically connect these pads 691,692, 693 to an electrical connector 659, apertures 621, 622, 623 of theconnector 659 can be aligned with the corresponding pads 691, 692, 693.In some examples, the connector 659 can define a single aperture foreach contact pad of the substrate 652 between which an electricalconnection is desired.

During the assembly or connection process between the substrate 652 andthe connector 659, once the pads 691, 692, 693 and correspondingapertures 621, 622, 623 are aligned, separate portions of flowableconductive material or solder 661, 662, 663 can be placed over anddisposed on the pads 691, 692, 693 and the corresponding apertures 621,622, 623. In some examples, a single portion of solder 661 can be placedon each corresponding pad 691 and aperture 621 pair. The solder portion661, 662, 663 can be in a solid state, and can have any desired shapeand size, for example, a spherical shape. In some examples and asdescribed herein, the solder 661, 662, 663 can be placed at the desiredlocation by a robot or another automated manufacturing device. Further,during the assembly process, the module 650 and the connector can bealigned with the connector 659 being disposed above the substrate 652.That is, the module 650 and the connector 659 can be arranged upsidedown relative to the orientation in which they are illustrated in FIG.8, or in any desired orientation or orientations. This arrangement canallow the solder portions 661, 662, 663 to rest over the apertures 621,622, 623 and pads 691, 692, 693 without the need for additionalcomponents or methods of retention.

With the solder portions 661, 662, 663 disposed at the desired locationsin line with the pads 691, 692, 693 and corresponding apertures 621,622, 623, the solder 661, 662, 663 can be melted and flowed to form anelectrical contact between each corresponding pad 691, 692, 693 andapertures 621, 622, 623. In some examples, the solder 661, 662, 663 canbe melted by a selective heating process. Once melted and flowed to formthe electrical connection, the selective heating process can be ceasedand the solder 661, 662, 663 can be solidified to form the electricalconnection between the pads 691, 692, 693 and corresponding apertures621, 622, 623.

In some examples, the melting temperature of the solder 661, 662, 663can be higher than a melting temperature, a degradation temperature,and/or a glass transition temperature of a material making up one ormore components of the module 650, such as the polymeric materialforming the lens 655. For example, the lens 655 can includepolycarbonate that can have a glass transition temperature of betweenabout 130° C. and 150° C., while the melting temperature of the solder661, 662, 663 can be between about 180° C. and 200° C. Accordingly, aselective heating process can heat the solder 661, 662, 663 above itsmelting temperature, while maintaining the temperature of anycomponents, such as the lens 655, below the component's melting,degradation, and/or glass transition temperature.

In some examples, a selective heating process can include focusing ordirecting the application of heat on a desired location, such as thesolder 661, 662, 663. In some examples, heat can be provided by adirected heater or by application of a laser to the solder 661, 662,663. In some examples, a selective heating process can include coolingor removing heat from desired areas, such as the lens 655. For example,a cold heat conductive medium, such as a cooled gas or liquid, can beapplied to all or a portion of the lens 655 to maintain its temperaturebelow a desired level. In some examples, a component, such as the lens655, can be provided with a protective shield or other barrier toprevent undesirable levels of heating. In some examples, a heat sink oranother component can be brought into thermal communication with thecomponent, such as the lens 655, to prevent undesirable levels ofheating. In some examples, a selective heating process can include anycombination of selective or directed heating and/or cooling processes onany number of components and/or the solder 661, 662, 663, as desired.Various examples of modules and electronic devices, as well as processesfor electrically connecting the same to other device components aredescribed below, with reference to FIGS. 9 and 10.

FIG. 9 shows a cross-sectional view of a module 750 of an electronicdevice, for example, a strobe module or a light emitting module, asdescribed herein. The module 750 can be substantially similar to, andcan include some or all of the features of, any of the modules describedherein, such as module 150, 250, 350, 450, 550, and 650.

In the present example, the module 750 can include a substrate 752 atleast partially defining an internal volume, with light sources 758disposed therein on the internal volume, as well as a connector 759 thatcan be electrically connected to the substrate 752 by solder portions757, as described herein. Further, the module 750 can be disposed in anaperture defined by a cover 740 of an electronic device and can beretained in this desired position by a brace 760 that can be coupled tothe substrate 752, for example, through a portion of a compliantmaterial 761.

Whereas the modules 550 and 650 described previously with respect toFIGS. 7 and 8 include a singular or unitary lens and a sidewallcomponent 555, 655, the module 750 of the present example includes alens 755 and a sidewall 753 that can be separate components ormaterials, and that are bonded or otherwise joined together to form themodule 750. As with the other sidewalls described herein, the sidewall753 can define a channel 754, and a gasket 756 can be disposed in thechannel to form a seal between the sidewall 753 and the cover 740.

In some examples, the sidewall 753 can be joined or bonded to the lens755 by any technique known in the art, or developed in the future, suchas co-molding, fusing, mechanical interaction, gluing, adhering,welding, any other technique, or combinations thereof. In some exampleswhere both the lens 755 and the sidewall 753 include polymeric material,the lens 755 and the sidewall 753 can be integrally formed by amulti-shot molding process, such as a dual shot injection moldingprocess. For example, the lens 755 can be injection molded, and thesidewall 753 can be formed by a second injection molding processincorporating the formed lens 755.

As the lens 755 includes a transparent material, in some examples, thesidewall 753 and/or gasket 756 can be visible to a user under certainconditions or angles. In such examples, it can be desirable for a colorof the sidewall 753 and/or gasket 756 to match or correspond to thecolor of the exterior surface of the cover 740, to provide a user with adesired cosmetic appearance. In some examples, the sidewall 653 caninclude a transparent material and the gasket 756 can include the same,similar, matching, or corresponding color as the exterior surface of thecover 740. In some examples, any other portion or component of thestrobe module 750, for example any portion or component that may bevisible to a user once the module 750 is incorporated into a device, canhave the same, similar, matching, or corresponding color as the exteriorsurface of the cover 740. For example, a material or materials of anambient light frequency sensor, a thermal sensor, and/or of a soldermask of the substrate 752 can have the same, similar, matching, orcorresponding color as the exterior surface of the cover 740. Additionalstructures and configurations of some examples of a module are describedbelow with reference to FIG. 10.

FIG. 10 shows a cross-sectional view of a module 850 of an electronicdevice, for example, a strobe module or a light emitting module, asdescribed herein. The module 850 can be substantially similar to, andcan include some or all of the features of, any of the modules describedherein, such as module 150, 250, 350, 450, 550, 650 or 750.

As with the other modules described herein, the module 850 can include asidewall 853 that at least partially defines both an internal volume andan exterior or external channel 854. The sidewall 853 can be coupled toa substrate 852, for example, at a flange or a base portion of thesidewall 853. A gasket 856 can be disposed in the channel 854 and canseal the sidewall 853 and a cover 840 of an electronic device in whichthe module 850 is included, as described herein.

The sidewall 853 can also be coupled to a lens 855 that can define anexterior surface of both the module 850 and a device including themodule 850. Whereas some examples of modules described herein include aunitary or integral lens and sidewall, in the example illustrated inFIG. 10, the lens 855 can be bonded or adhered to a top surface of thesidewall 853. In some examples, the lens 855 can be disposed entirelyabove the sidewall 853, and no portion of the lens can extend into avolume at least partially defined by the sidewall 853. In some examples,the lens 855 can be bonded to the sidewall 853 by an adhesive or a glue,such as a pressure sensitive adhesive 859 or other similar bindingmaterial.

In addition to the first light source 857 and the second light source858, one or more additional components can be disposed on, and can beelectrically connected to, the substrate in the internal volume, asdescribed herein. In some examples, one or more sensors 861, 862 can bedisposed on the substrate 852 in the internal volume. In some examples,the sensors 861, 862 can be any sensors or other type of component thatcan interact with, detect, or otherwise rely on light from the ambientenvironment, for example, light that passes through the lens 855.

In some examples, the sensor 861 can include a thermal sensor that candetect the temperature of at least one of the internal volume of themodule 850, the internal volume of a device including the module 850, oran ambient environment outside the module 850. In some examples, thethermal sensor 861 can communicate with one or more other components ofthe module 850, such as the light sources 857, 858. For example, thethermal sensor 861 can communicate with a processor of the deviceincluding the module 850, and if a temperature of the light sources 857,858 or the internal volume of the module is detected as rising above apredetermined threshold, the processor can modify the behavior orfunction of the light sources 857, 858, for example, by attenuating orturning off one or both light sources 857, 858 to prevent overheatingand possible damage to the module 850.

In some examples, the sensor 862 can include a light sensor, such as anambient light frequency sensor. The ambient light frequency sensor 862can receive light from the ambient environment through the lens 855 andcan detect the presence and/or amount of any variations in lighting thatis not otherwise perceptible to a user. For example, in an environmentlit with fluorescent lighting, the lighting can vary, oscillate, orflicker at a rate of about 60 Hz. While this flicker is not apparent toa user, imaging components of an electronic device, such as a camera,can pick-up or be susceptible to the flicker. Accordingly, the ambientlight frequency sensor 862 can detect if such a flicker or lightingvariation exists and can determine the rate or frequency of the detectedflicker. In some examples, the ambient light frequency sensor 862 candetect any number of other properties of ambient light, such as thecolor or temperature of ambient light, and the intensity of ambientlight. In some examples, the ambient light frequency sensor 862 cancommunicate with the light sources 857, 858 of the module, for example,through a processor of the device, to command the light sources 857, 858to emit light in such a way as to at least partially attenuate theflicker or lighting variation, and to allow other components, such as acamera, to capture an image or images with attenuated flickering orlighting variations. Additional examples of modules and processes forelectrically connecting the same to other device components aredescribed below with reference to FIG. 11.

FIG. 11 shows a top view of a module 950 of an electronic device, forexample, a strobe module or light emitting module, as described herein.The module 950 can be substantially similar to, and can include some orall of the features of, any of the modules described herein, such asmodule 150, 250, 350, 450, 550, 650, 750, or 850.

As with other modules described herein, the module 950 can include asidewall 953 that at least partially defines an internal volume, and alens 955 that at least partially defines the internal volume and anexterior surface of the module 950. A first light source 957 and asecond light source 958 can be disposed in the internal volume under, orin line with the lens 955. In some examples, the first and second lightsources 957, 958 can be substantially similar or the same components,such as an LED. In some examples, a light source 957, 958 of the module950 can include an LED having an area of about 1 square millimeter,although substantially any desired size and type of LED can be used. Insome examples, the LEDs 957, 958 can be disposed adjacent to one anotherand can be under a central portion of the lens 955. For example, each ofthe LEDs 957, 958 can be disposed under a focusing portion of amultifocal Fresnel lens, as shown. In some examples, however,substantially any number, size, and/or type of light source or sourcescan be disposed in the internal volume of the module 950.

Further, additional components such as sensors 961, 962 can be disposedin the internal volume under the lens 955. In some examples, the module950 can include an ambient light frequency sensor 961 and a thermalsensor 962, for example, as described with respect to sensors 861, 862of FIG. 10. In some examples, a module 950 including two LEDs 957, 958that can be about 1 square millimeter in area can produce a desiredlevel of brightness, while allowing for enough space under the lens 955that the sensors 961, 962 can be disposed adjacent to the light sources957, 958 under the lens without the need for a lens having a diametersubstantially larger than the width of the light sources 957, 958.Accordingly, in some examples the lens 955 can have a diameter of lessthan about 10 millimeters, less than about 8 millimeters, less thanabout 6 millimeters, less than about 4 millimeters, less than about 2millimeters, or less than about 1 millimeter or smaller.

In some examples, any portion or component of the strobe module 950, forexample any portion or component that may be visible to a user once themodule 950 is incorporated into a device, can have the same, similar,matching, or corresponding color as an exterior surface of theelectronic device including the module 950. For example, a material ormaterials of an ambient light frequency sensor 961, a thermal sensor962, and/or of a solder mask of the substrate 952 can have the same,similar, matching, or corresponding color as an exterior surface of theelectronic device, such as the portion of the cover of the devicesurrounding the module 950.

Any number or variety of electronic device components can include themodules described herein, such as a strobe module. The process forjoining such a module to an electrical connector can include anycombination of localized heating and or cooling processes that can meltsolder to electrically connect the module to one or more othercomponents of an electronic device, without undesirably heating otherportions of the module. An electronic device including the module caninclude a cover defining an exterior surface of the device, and anaperture. In some examples, the module can further define the exteriorsurface, and can be disposed in the aperture such that one or moredesired components of the module can be positioned between the exteriorsurface and an interior surface of the cover. Various examples ofmodules and electronic devices, as well as processes for electricallyconnecting the same to other device components are described below withreference to FIG. 12.

FIG. 12 shows a process flow diagram for a method 1000 of joining amodule including a polymer or other heat sensitive material to anelectrical connector. The module can include some or all of the featuresof any of the modules described herein, such as module 150, 250, 350,450, 550, 650, 750, 850, and 950. The method 1000 can include aligningapertures defined by a connector with contact pads of a module includinga polymer or other relatively heat sensitive material at block 1010,placing a flowable conductive material, such as solder, over the alignedapertures and pads at block 1020, melting the conductive material withthe selective application of heat at block 1030, and flowing theconductive material at block 1040 to form an electrical contact betweenthe aligned aperture of the connector and the contact pad of the module.

At block 1010, an aperture or apertures define by an electricalconnector can be aligned with a corresponding contact pad or pads of asubstrate of a module, as described herein with respect to module 650 ofFIG. 8. In some examples, the connector can be a flexible connector. Insome examples, the substrate can define an exterior surface of themodule and can include contact pads that are in electrical communicationwith one or more components of the module, such as the light sources. Insome examples, the aperture or apertures of the connector can be lined,coated, plated, or can otherwise include a conductive contact materialthat can be in electrical communication with other components of thedevice, for example, through wires or vias of the connector.

At block 1020, a flowable or malleable conductive material can be placedor positioned in line with the apertures defined by the connector andthe corresponding pads of the module. In some examples, the portion orportions of conductive material can be placed over or above eachcorresponding pad and aperture. In some examples, the module andconnector can be positioned or oriented such that the portions ofconductive material can rest at a desired location without the need foradditional retaining features, materials, components or techniques. Insome examples, a robot or other automated manufacturing apparatus canplace or position the portions of conductive material in the desiredlocations. In some examples, a location can be chosen such that theconductive material can melt and flow to form an electrical connectionbetween the contact pad an aperture, as desired.

The flowable or malleable conductive material can be solder, asdescribed herein with respect to solder portions 561, 562, 563 of FIG.8. In some examples, any form, type, or composition of solder can beused. In some examples, the solder can be any fusible metal alloy, suchas an alloy containing one or more of tin, copper, silver, bismuth,indium, zinc, antimony, or other metals. In some examples, the flowableor malleable conductive material can be a curable conductive material,such as a conductive epoxy material. In some example, a conductive epoxycan be applied to desired location, such as in line with the aperturesdefined by the connector and the corresponding pads of the module.

At block 1030, the solder or conductive material can be melted by aselective heating process. In some examples, a selective heating processcan include focusing or directing the application of heat on a desiredlocation, such as the solder or conductive material. In some examples,heat can be provided by a directed heater, by application of a laser tothe solder, by solder jetting, and/or by a stream or jet of heated airor gas. In some examples, a selective heating process can includecooling or removing heat from desired areas, such as the polymericportions of the module, for example, the lens. In some examples, a coldheat conductive medium, such as cooled air or liquid can be applied toall or a portion of the module to maintain the temperature of portionsincluding a polymeric material below a desired level. In some examples,a component including a polymer, such as the lens of the module can beprovided with a protective shield or other barrier to preventundesirable levels of heating in a selective heating process. In someexamples, a heat sink or other component can be brought into thermalcommunication with the component including a polymer, such as lens, toprevent undesirable levels of heating in the selective heating process.In some examples, a selective heating process can include anycombination of selective or directed heating and/or cooling processes onany number of components and/or conductive material or solder, asdesired.

In some examples, the selective heating process can heat the conductivematerial above its melting temperature or glass transition temperature.For example, where the conductive material includes solder, theselective heating process can heat the conductive material to aboveabout 180° C., above about 190° C., above about 200° C., above about225° C., above about 250° C., or even higher. Further, a portion orcomponent of the module including a polymer can be maintained at atemperature below the melting, degradation, and/or glass transitiontemperature of the polymer during the selective heating process, asdescribed herein. For example, the temperature of the portion of themodule including a polymer can be maintained below about 175° C., belowabout 150° C., below about 140° C., below about 130° C., below about120° C., below about 110° C., below about 100° C., or even lower.

At block 1040, the melted conductive material can flow to form anelectrical contact between corresponding contact pads of the module andaperture of the connector. Although indicated as a separate step fromblock 1030, in some examples the flowing of the conductive material canoccur concurrently with or as a result of the melting achieved by theselective heating process in block 1030. The process 1000 can furtherinclude solidifying the melted and flowed conductive material once anelectrical contact has been formed. In some examples, the conductivematerial can be solidified by removing or ceasing the selective heatingprocess.

In some examples, such as where the flowable or malleable conductivematerial placed or positioned at block 1020 includes a curableconductive material, such as a conductive epoxy, the method 1000 may notcomprise a block 1030 and block 1040 may include curing or solidifyingthe flowable or malleable conductive material at the desired location toform the electrical contact between corresponding contact pads of themodule and aperture of the connector. For example, the flowable ormalleable conductive material can be placed or positioned in block 1020while already in a malleable or deformable state and can subsequently becured or solidified at block 1040 without the need to melt orselectively heat the flowable or malleable conductive material at block1030. In some examples, the flowable or malleable conductive materialcan be cured or solidified by exposing the flowable or malleableconductive material to one or more curing agents or environmentalconditions. For example, a flowable or malleable conductive material canbe cured or solidified by exposure to one or more chemical agents,and/or exposure to certain wavelengths of light, such as UV light.

In some examples, a portion of the conductive material can protrude lessthan about 160 microns from the surface of the contact pad of themodule, as described herein. In some examples, the height from theinterior surface of a cover defining an aperture in which the module isdisposed to the furthest surface of the conductive material can be lessthan 1000 microns, less than 900 microns, less than 850 microns, lessthan 800 microns, less than 750 microns, or less than 700 microns orsmaller. In some examples, this height can be about 835 microns.

Any of the features or aspects of the components discussed herein can becombined or included in any varied combination. For example, the designand shape of the modules described herein are not limited in any way,and can be formed by any number of processes, including those discussedherein. Further, the module can include light sources and othercomponents that can emit light or provide any other function by anymethod now known or discovered in the future. The principles andstructure described with respect to the modules can also be used inconjunction with other types of module and/or assemblies and are notlimited to being applicable to light emitting modules.

To the extent applicable to the present technology, gathering and use ofdata available from various sources can be used to improve the deliveryto users of invitational content or any other content that may be ofinterest to them. The present disclosure contemplates that in someinstances, this gathered data may include personal information data thatuniquely identifies or can be used to contact or locate a specificperson. Such personal information data can include demographic data,location-based data, telephone numbers, email addresses, TWITTER® ID's,home addresses, data or records relating to a user's health or level offitness (e.g., vital signs measurements, medication information,exercise information), date of birth, or any other identifying orpersonal information.

The present disclosure recognizes that the use of such personalinformation data, in the present technology, can be used to the benefitof users. For example, the personal information data can be used todeliver targeted content that is of greater interest to the user.Accordingly, use of such personal information data enables users tocalculated control of the delivered content. Further, other uses forpersonal information data that benefit the user are also contemplated bythe present disclosure. For instance, health and fitness data may beused to provide insights into a user's general wellness or may be usedas positive feedback to individuals using technology to pursue wellnessgoals.

The present disclosure contemplates that the entities responsible forthe collection, analysis, disclosure, transfer, storage, or other use ofsuch personal information data will comply with well-established privacypolicies and/or privacy practices. In particular, such entities shouldimplement and consistently use privacy policies and practices that aregenerally recognized as meeting or exceeding industry or governmentalrequirements for maintaining personal information data private andsecure. Such policies should be easily accessible by users and should beupdated as the collection and/or use of data changes. Personalinformation from users should be collected for legitimate and reasonableuses of the entity and not shared or sold outside of those legitimateuses. Further, such collection/sharing should occur after receiving theinformed consent of the users. Additionally, such entities shouldconsider taking any needed steps for safeguarding and securing access tosuch personal information data and ensuring that others with access tothe personal information data adhere to their privacy policies andprocedures. Further, such entities can subject themselves to evaluationby third parties to certify their adherence to widely accepted privacypolicies and practices. In addition, policies and practices should beadapted for the particular types of personal information data beingcollected and/or accessed and adapted to applicable laws and standards,including jurisdiction-specific considerations. For instance, in the US,collection of or access to certain health data may be governed byfederal and/or state laws, such as the Health Insurance Portability andAccountability Act (HIPAA); whereas health data in other countries maybe subject to other regulations and policies and should be handledaccordingly. Hence different privacy practices should be maintained fordifferent personal data types in each country.

Despite the foregoing, the present disclosure also contemplates examplesin which users selectively block the use of, or access to, personalinformation data. That is, the present disclosure contemplates thathardware and/or software elements can be provided to prevent or blockaccess to such personal information data. For example, in the case ofadvertisement delivery services, the present technology can beconfigured to allow users to select to “opt in” or “opt out” ofparticipation in the collection of personal information data duringregistration for services or anytime thereafter. In another example,users can select not to provide mood-associated data for targetedcontent delivery services. In yet another example, users can select tolimit the length of time mood-associated data is maintained or entirelyprohibit the development of a baseline mood profile. In addition toproviding “opt in” and “opt out” options, the present disclosurecontemplates providing notifications relating to the access or use ofpersonal information. For instance, a user may be notified upondownloading an app that their personal information data will be accessedand then reminded again just before personal information data isaccessed by the app.

Moreover, it is the intent of the present disclosure that personalinformation data should be managed and handled in a way to minimizerisks of unintentional or unauthorized access or use. Risk can beminimized by limiting the collection of data and deleting data once itis no longer needed. In addition, and when applicable, including incertain health related applications, data de-identification can be usedto protect a user's privacy. De-identification may be facilitated, whenappropriate, by removing specific identifiers (e.g., date of birth,etc.), controlling the amount or specificity of data stored (e.g.,collecting location data a city level rather than at an address level),controlling how data is stored (e.g., aggregating data across users),and/or other methods.

Therefore, although the present disclosure broadly covers use ofpersonal information data to implement one or more various disclosedembodiments, the present disclosure also contemplates that the variousembodiments can also be implemented without the need for accessing suchpersonal information data. That is, the various embodiments of thepresent technology are not rendered inoperable due to the lack of all ora portion of such personal information data. For example, content can beselected and delivered to users by inferring preferences based onnon-personal information data or a bare minimum amount of personalinformation, such as the content being requested by the deviceassociated with a user, other non-personal information available to thecontent delivery services, or publicly available information.

As used herein, the terms exterior, outer, interior, inner, top, andbottom are used for reference purposes only. An exterior or outerportion of a component can form a portion of an exterior surface of thecomponent but may not necessarily form the entire exterior of outersurface thereof. Similarly, the interior or inner portion of a componentcan form or define an interior or inner portion of the component but canalso form or define a portion of an exterior or outer surface of thecomponent. A top portion of a component can be located above a bottomportion in some orientations of the component, but can also be locatedin line with, below, or in other spatial relationships with the bottomportion depending on the orientation of the component.

Various inventions have been described herein with reference to certainspecific embodiments and examples. However, they will be recognized bythose skilled in the art that many variations are possible withoutdeparting from the scope and spirit of the inventions disclosed herein,in that those inventions set forth in the claims below are intended tocover all variations and modifications of the inventions disclosedwithout departing from the spirit of the inventions. The terms“including:” and “having” come as used in the specification and claimsshall have the same meaning as the term “comprising.”

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. A strobe module, comprising: a Fresnel lens atleast partially defining an internal volume, the Fresnel lens comprisinga lens body; a sidewall joined to the Fresnel lens, the sidewall atleast partially defining the internal volume and an external surface ofthe strobe module including an external channel, the sidewall being aseparate component from the Fresnel lens, at least a portion of theFresnel lens is surrounded by the sidewall and disposed within a volumedefined by the sidewall; a gasket disposed in the external channel; asubstrate in contact with the sidewall, the substrate at least partiallydefining the internal volume; and a light source disposed on thesubstrate in the internal volume.
 2. The strobe module of claim 1,wherein the sidewall is transparent.
 3. The strobe module of claim 1,wherein the sidewall comprises a different material than the Fresnellens.
 4. The strobe module of claim 1, wherein the light sourcecomprises a light emitting diode (LED).
 5. The strobe module of claim 1,wherein the light source comprises two LEDs and the strobe modulefurther comprises an ambient light frequency sensor and a thermal sensordisposed on the substrate in the internal volume.
 6. The strobe moduleof claim 1, wherein the Fresnel lens comprises polycarbonate.
 7. Thestrobe module of claim 6, wherein a portion of the Fresnel lenscomprises an acrylic hard coat.
 8. An electronic device, comprising: acover connected to an outer perimeter of the electronic device anddefining an external surface of the electronic device, an interiorsurface, an aperture, and an aperture wall positioned between andsubstantially orthogonal to the external surface and the interiorsurface, the aperture wall being planar along a cross-section of thecover; a strobe module at least partially disposed in the aperture, thestrobe module comprising: a Fresnel lens further defining the externalsurface of the electronic device; a sidewall of the Fresnel lensabutting the aperture wall and at least partially defining an internalvolume of the strobe module and defining a channel, the sidewall coupledto the cover; a substrate coupled to the sidewall, the substrate furtherdefining the internal volume; a light source disposed on the substratein the internal volume; and a gasket disposed in the channel between theexternal surface and the interior surface, and between the sidewall andthe aperture wall of the cover, the gasket sealing the sidewall to theaperture wall.
 9. The electronic device of claim 8, further comprising aflexible connector joined to the substrate and in electricalcommunication with the light source.
 10. The electronic device of claim9, wherein the flexible connector is joined to the substrate withsolder.
 11. The electronic device of claim 10, wherein a distance froman internal surface of the cover to a surface of the solder protrudingfrom the flexible connector is less than 1 millimeter.
 12. Theelectronic device of claim 8, wherein the gasket comprises an o-ring.13. The electronic device of claim 12, wherein the o-ring comprises asame color as a portion of the cover defining the external surface. 14.The electronic device of claim 8, wherein the light source comprises anLED.